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Huawei's Chip Technology Lagging Behind US Counterparts

Huawei's chip technology is struggling to keep up with US competitors. Despite plans to catch up, the gap is widening as the industry races towards 2nm.

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1 min read
In the picture there is a data card connected to a laptop.
In the picture there is a data card connected to a laptop.

Huawei's Chip Technology Lagging Behind US Counterparts

Huawei's chip technology is facing a significant gap compared to its US counterparts, with reports indicating it's currently two generations behind. Despite this, the company continues to innovate, with unconfirmed reports suggesting plans to develop a 5nm chipset soon.

Huawei's latest System-on-Chip, the Kirin X90, powering the MateBook Fold PC, is manufactured using SMIC's 7nm N+2 process node. This is a step behind the 5nm process used by leading companies like Apple, AMD, and Qualcomm, as per TechInsights' analysis. Huawei's previous chipsets, including the Kirin 9020 5G used in the Mate 70 series, also rely on the 7nm process.

Major foundries like TSMC and Samsung are set to produce 2nm chips within the next 12 to 24 months, further widening the gap. Huawei's founder, Ren Zhengfei, previously acknowledged the company's chip technology was one generation behind the US.

Huawei's chip technology is multiple generations behind leading companies, with its latest chipset using a 7nm process. While unconfirmed reports hint at plans to develop a 5nm chipset, major foundries are already looking towards 2nm technology. Huawei's challenge lies in bridging this gap in a rapidly evolving semiconductor landscape.

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